- 2025–2026. Successful manufacturing of thin-film components for advanced electronics and photonics.
- 2025. Initiation and ongoing development of a full-wave FDTD simulation code, including early validation and testing of core numerical routines.
- May 2024. Successful fabrication and testing of a thin-film device using our proprietary patterning equipment.
- October 2023. Direct-patterning test completed at ORNL using the jointly developed instrument.
- April 2022. Third-party validation of direct-writing patterning on our thin-film material.
- February 2022. Simulation code released to model the impact of disorder—dislocations, point defects, strain—on x-ray diffraction intensities.
- December 2019. Strong ferromagnetic double-layer structure developed for handheld electronics.
- September 2019. Rare-earth-free magnetic thin films created from common, affordable elements for semiconductor manufacturing.