Reciprocal Engineering01 — Grow
Advanced thin-film growth
Epitaxial oxide films with precise control of composition and thickness, compatible with standard PVD and CVD processes.
Thin-film platform · Helsinki, Finland
Circuits written inside the film.
We grow a patented new class of functional oxide material, then use direct patterning to create embedded circuits inside it — without rare-earths, toxic chemicals or ultrapure water, and with minimal energy consumption.
SAPPHIRE/
LiNbO₃/
LiTaO₃/
GaN/
AlN/
α-SiO₂/
Si/
SiC
The platform
Patterning is not printed on the film. It happens in it.
Conventional circuit fabrication builds structures layer by layer on a surface, using masks, photoresist and etch chemistry. Our platform grows a functional oxide film, then writes the circuit into that film with a focused beam. Nothing is deposited, masked or removed.
02 — Write
Patented direct patterning
A validated, re-writable maskless process defines any pattern with ease — and rewrites it. Design iteration happens in hours, not mask sets.
03 — Embed
Functional circuits inside the film
Inductors, interconnects, resonators, heaters and sensors are formed within the film — protected by the material that surrounds them.
Differentiators
What the platform does that surface patterning cannot.
Re-writable embedded patterning
Structures can be written, erased and rewritten in the same film, turning fabrication into an iterative design step.
Crystallographically oriented materials
Growth control extends to orientation, so anisotropic material properties can be designed in rather than accepted.
Magnetic inclusions in transparent oxides
Magnetic functionality placed inside an optically transparent host — a combination surface processes cannot deliver.
Multilayer embedded architectures
Circuits can be stacked through the film's depth, using the third dimension instead of more die area.
LiNbO₃ and advanced substrates
Sapphire, lithium niobate, silicon and silicon carbide — the substrates that RF, photonic and high-temperature circuits already require.
Photoresist-, etch- and solvent-free
The write step needs no mask, no resist, no developer and no etchant, which removes most of the process chemistry entirely.
Results
Independently validated.
Films, patterned conductors and embedded circuits produced on the platform — grown, written and characterised, with results validated by independent research organisations at US national laboratories and European research institutes.
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Sustainability
The advantage is as much what we leave out.
Semiconductor patterning is defined by its consumables. Ours needs none of them.
Masks, photoresists, developers, etchants and the ultrapure water used to rinse them account for much of the cost, footprint and permitting burden of a fab line. A direct-write process removes that chain — and with it the rare-earth dependency and the energy load of the steps that support it.
Not used in the process
- masks
- photoresist
- etching
- solvents
- ultrapure water
- toxic chemicals
- rare-earth elements
Where it applies
Domains where embedding beats surface fabrication.
RF & microwave
Embedded inductors, interconnects and resonators built directly in low-loss oxide films.
THz & optics
Metasurfaces and metamaterials with tunable, engineered spectral responses.
Integrated photonics
Structures written in lithium niobate and other electro-optic hosts.
Sensing
Heaters and sensor elements protected inside the film they measure through.
Harsh environments
Silicon carbide and sapphire platforms for high-temperature and high-radiation service.
Investor & partner enquiries
Talk to us about the platform.
We work with investors evaluating the technology and with pilot customers who want circuits written into their own material stack. Both conversations start the same way.
CompanyReciprocal Engineering Oy
LocationHelsinki, Finland