Direct‑patterned thin‑film devices — the digital‑camera moment for electronics
1. GROW A FILM, 2. PATTERN ANY DEVICE
No masks. No photoresists. No etching. Reset and re‑pattern when needed — extremely fast, scalable, and environmentally cleaner.
Core advantages
- Resettable direct patterning enabled by unique material properties
- Validated device manufacturing: thin‑film capacitors, inductors, resistors and more
- Mass‑production compatible — room‑temperature, mask‑free direct writing
- Compatible with UV lasers, PIC manufacturing, and standard industrial deposition
- Supports buried layers, vias, 3D & embedded patterning; sub‑10 nm features (facility‑limited)
Materials & sustainability
- Ferromagnetic insulators and ferromagnetic conductors — magnetic at elevated temperatures
- Paramagnetic insulators; low‑ and high‑permeability conductors
- Optically transparent, electrically insulating magnetic thin films
- RoHS‑compliant cleantech — free of rare‑earth elements (REEs), heavy metals, Cr(VI), Fe, and Os
- EMI shielding effective up to tens of GHz
Technology stack
We provide a closed‑loop workflow linking AI‑assisted design, direct patterning, and in‑situ measurement. The stack includes:
- Clean, scalable thin films validated for passive components and device integration
- Integrated modeling and experimentation — analytical and numerical solutions
- Custom X‑ray scattering modeling for complex device structures
- In‑house FDTD simulation code for mixed optical–electronic circuit modeling (waveguides, optical structures, thin‑film devices)
- Consultation and co‑development with world‑class laboratories
Applications
- Photonic Integrated Circuits (waveguides, phase/intensity modulators, hybrid optoelectronics)
- 5G/6G RF and microwave filters, sensors, waveguides, MMICs
- MRAM, spintronics, all‑spin logic (ASL) and tunable components
- MEMS, IoT devices, and hybrid electronic‑photonic integration
- High‑quality crystalline films on Si/SiO₂, SiC, GaN, AlN, LiNbO₃, LiTaO₃, sapphire, a‑SiO₂
Validated features
- Excellent reproducibility and device‑level validation
- Semiconductor‑industry compatibility — direct on‑chip integration without surface mounting
- Electrical conductivity and magnetization precisely tunable for manufacturing
- Functional at and above elevated temperatures
- Direct‑patterning tool constructed and validated through successful thin‑film device fabrication and testing
What our patterning process eliminates
- No photoresists, developers, etching, or fluorine gas
- No additional material layers or ion implantation
- Simplified workflow that creates conductive and insulating regions directly in the film
Why this matters
Traditional lithography is slow, complex, expensive, environmentally harmful, and facility‑intensive. It depends on resist chemistry, etching, and centralized foundries. Our approach removes those bottlenecks — enabling distributed, lower‑cost, faster prototyping and production for small and innovative companies.
Get started
We offer consultation, co‑development, and prototype services to integrate direct‑patterned thin‑film devices into your products. From AI‑assisted design to in‑situ testing and FDTD‑backed simulation, we deliver a complete path from concept to validated device.
